Industrial, Collaborative and Mobile Robotics in Latin America: Review of Mechatronic Technologies for Advanced Automation

Authors

  • Jose Cornejo
    jose.cornejo@ieee.org
    1) Universidad Tecnológica del Perú, Lima, Peru. 2) Center for Space Emerging Technologies (C-SET), Canada. 3) Department of Electromechanical Engineering, University of Burgos, 09006 Burgos,, Spain https://orcid.org/0000-0003-4096-9337
  • S. Barrera Universidad Regiomontana U-ERRE, Monterrey,, Mexico
  • C. A. Herrera Ruiz Universidad Regiomontana U-ERRE, Monterrey,, Mexico
  • F. Gutierrez Centro Universitario de Automación y Robótica (CUDAR), Facultad Regional Córdoba, Universidad Tecnológica Nacional, Córdoba,, Argentina
  • M. O. Casasnovas Centro Universitario de Automación y Robótica (CUDAR), Facultad Regional Córdoba, Universidad Tecnológica Nacional, Córdoba,, Argentina
  • Leonardo Kot 6) Modular Robot Company, Ciudad de Buenos Aires, Argentina. 7) SURU Robotics S.R.L., Ciudad de Buenos Aires, Argentina., Argentina
  • M. A. Solis 8) Facultad de Ingenierí­a, Universidad Andres Bello, Santiago, Chile. 9) Centro de Innovación y Robótica, Valparaí­so,, Chile
  • R. Larenas Facultad de Ingenierí­a, Universidad Andres Bello, Santiago,, Chile
  • F. Castro-Nieny 10) Chief Robotics Officer Department, OKtopus Robotics Spa, Santiago, Chile. 11) Chief Executive Officer Department, Austral-Robotics Ltda, Santiago,, Chile
  • M. R. Arbulú Saavedra 12) Mechatronics Engineering Program, Corporación Universitaria del Huila (CORHUILA), Colombia. 13) Robotics 4.0,, Colombia
  • R. Rodrí­guez Serrezuela Mechatronics Engineering Program, Corporación Universitaria del Huila (CORHUILA),, Colombia
  • Y. Muñoz Londoño Escuela de Ciencias Jurí­dicas y Polí­ticas, Universidad Nacional Abierta y a Distancia (UNAD),, Colombia
  • Alejandro Serna Instituto Colombiano de Robótica Avanzada, Medellí­n,, Colombia
  • D. Ortega-Aranda Parque de Investigación e Innovación Tecnológica, Centro de Ingenierí­a y Desarrollo Industrial (CIDESI), Nuevo León,, Mexico
  • S. Aranda-Miramontes Parque de Investigación e Innovación Tecnológica, Centro de Ingenierí­a y Desarrollo Industrial (CIDESI), Nuevo León,, Mexico
  • I. Chang Facultad de Ingenierí­a Eléctrica, Universidad Tecnológica de Panamá,, Panama
  • M. Cardona Universidad Don Bosco,, El Salvador
  • A. Carrasquilla-Batista Ingenierí­a Mecatrónica, Instituto Tecnológico de Costa Rica,, Costa Rica
  • R. Palomares Professional School of Mechatronics Engineering, Universidad Ricardo Palma, Lima,, Peru
  • R. Rodriguez Laboratorio de Investigación en Inteligencia Artificial, Automatización, Robótica y Control, Universidad Nacional de Ingenierí­a, Lima,, Peru
  • Ruben Parisuaña Mecanos Automation S.A.C., Lima,, Peru
  • Miguel Bórquez ABB México S.A. de C.V.,, Mexico
  • Oscar Navarro KUKA Latinoamerica,, Spain
  • Fernando Sanchez Clúster KUKA Iberoamerica,, Spain
  • I. A. Bonev Mecademic Inc., 1300 Saint-Patrick Street Montreal, QC,, Canada
  • Jonathan Coulombe Mecademic Inc., 1300 Saint-Patrick Street Montreal, QC,, Canada
  • F. Martí­n Rico Intelligent Robotics Lab, Universidad Rey Juan Carlos, Madrid,, Spain
  • B. L. Treviño-Elizondo School of Engineering and Sciences, Tecnológico de Monterrey, Monterrey, NL,, Mexico
  • H. Garcí­a-Reyes School of Engineering and Sciences, Tecnológico de Monterrey, Monterrey, NL,, Mexico
  • A. Sollazzo Institute for Advanced Architecture of Catalonia (IAAC), Barcelona,, Spain
  • A. Dubor Institute for Advanced Architecture of Catalonia (IAAC), Barcelona,, Spain
  • A. Markopoulou Institute for Advanced Architecture of Catalonia (IAAC), Barcelona,, Spain
  • C. De Marinis Institute for Advanced Architecture of Catalonia (IAAC), Barcelona,, Spain
  • Marco Chacin Airbus,, United Kingdom
  • Andres Mora Axient Corp,, United States
  • M. Pérez-Ruiz Universidad de Sevilla. írea de Ingenierí­a Agroforestal, 41013, Sevilla,, Spain
  • A. Ribeiro Centre for Automation and Robotics (CAR), CSIC-UPM, 28500 Arganda del Rey, Madrid,, Spain
  • E. A. L'Huillier Harrisburg University of Science and Technology, Data Analytics program, Harrisburg 17057,, United States
Mechatronics and Robotics (MaR) have recently gained importance in product development and manufacturing settings and applications. Therefore, the Center for Space Emerging Technologies (C-SET) has managed an international multi-disciplinary study to present, historically, the first Latin American general review of industrial, collaborative, and mobile robotics, with the support of North American and European researchers and institutions. The methodology is developed by considering literature extracted from Scopus, Web of Science, and Aerospace Research Central and adding reports written by companies and government organizations. This describes the state-of-the-art of MaR until the year 2023 in the 3 Sub-Regions: North America, Central America, and South America, having achieved important results related to the academy, industry, government, and entrepreneurship; thus, the statistics shown in this manuscript are unique. Also, this article explores the potential for further work and advantages described by robotic companies such as ABB, KUKA, and Mecademic and the use of the Robot Operating System (ROS) in order to promote research, development, and innovation. In addition, the integration with industry 4.0 and digital manufacturing, architecture and construction, aerospace, smart agriculture, artificial intelligence, and computational social science (human-robot interaction) is analyzed to show the promising features of these growing tech areas, considering the improvements to increase production, manufacturing, and education in the Region. Finally, regarding the information presented, Latin America is considered an important location for investments to increase production and product development, taking into account the further proposal for the creation of the LATAM Consortium for Advanced Robotics and Mechatronics, which could support and work on roboethics and education/R+D+I law and regulations in the Region.

 

Doi: 10.28991/ESJ-2023-07-04-025

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